Airbus Deutschland GmbH, Air Force Research Laboratory, ANSYS,Inc., Applied Research Associates, AREVA NP GmbH, Asahi Chemical Industries, Assystem GmbH, ATEC Weiss GmbH & Co. KG, ATR International, BASF AG, Brother Industries, Ltd., Brunel GmbH, Cadence Design Systems, Inc., CADFEM GmbH, CADMIT Inc., Calcom ESI, Canon Inc., Centre National de la Recherche Scientifique, Chiba Institute of Technology, CIMPA GmbH, COLENCO Power Engineering AG, Commissariat a l‘Energie Atomique (CEA), Continental AG, CST AG, Det Norske Veritas, Dornier GmbH, EADS, Endress+Hauser GmbH & Co. KG, ESTECO, European Space Agency, fischerwerke GmbH & Co. KG, Fujifilm Corporation, Gesellschaft für Anlagen- und Reaktorsicherheit (GRS) mbH, Harman/Becker Automotive Systems GmbH, Hydro-Québec, IMCC Austria, Institut Francais du Pétrole (IFP), Institut für Verbundwerkstoffe GmbH, Intel Corporation, Japan Atomic Energy Research Institute, Leibniz-Institut für Agrartechnik Potsdam-Bornim e.V. (ATB), LMS International, Lockheed Martin Corporation, Lumics GmbH, MAN Diesel & Turbo SE, MathConsult GmbH, Mitsubishi Materials Corporation, MTU Friedrichshafen GmbH, NASA, Natexis Banques Populaires, Nestec S.A., Nestlé S.A., Nippon Steel Corporation, Noesis Solutions, Norges Geotekniske Institutt (NGI), Odense Steel Ship Yard Ltd., OHRA Regalanlagen GmbH, Petrobras, PTC, RIKEN, Robert Bosch GmbH, Saint Gobain / Norton Industrial Ceramics, Schaeffler Technologies GmbH & Co. KG, Shell, Siemens AG, Siemens MR Magnet Technology, Siemens VAI Metals Technologies GmbH, Star One S.A., Statoil, Glas Trösch Holding AG, ThyssenKrupp Steel Europe, TÜV SÜD Industrie Service GmbH, TriQuint Semiconductor, Inc., TRW Automotive, voestalpine Stahl GmbH, VOITH Engineering Services GmbH, Voith Hydro, XEROX Corporation, Zeppelin Systems GmbH, etc.
Aoyama University, RWTH Aachen, Argonne National Lab, University of Athens, University of Alabama, Aalborg University, Abo Akademi University, Universität Bayreuth, Universität Bielefeld, TU Braunschweig, Cardiff University, Carnegie Mellon University, Cornell University, Chalmers University, National Chung Cheng University, Technical University of Crete, East China Normal University, Universität Dortmund, Dublin City University, Universität Erlangen-Nürnberg, EPFL, Fraunhofer-Insititut, Universität Freiburg, Florida Atlantic University, Florida State University, Universität Greifswald, TU Hamburg, Harvard Medical School, Universität Hannover, Indian Institute of Technology, Instituto de Estudos Superiores da Amazônia, University of Illinois, Kyoto University, Universität Konstanz, Universität Karlsruhe, Universität Linz, Livermore National Lab, Louisiana State University, Los Alamos National Lab, Levich Institute, Max-Planck-Gesellschaft, TU München, Universität der Bundeswehr München, Universität Münster, University of Maine, University of Minnesota, Oak Ridge National Lab, Okayama University, Ecole Centrale de Paris, Universite de Provence, Universite de Pau, University of Pittsburgh, Universität Paderborn, Princeton University, Rice University, Universität Stuttgart, Stanford University, SINTEF, Simula Research Lab, Sandia National Lab, University Trieste, Tallinn University of Technology, Ecole Nationale D’Ingenieurs de Tarbes, Universität Tübingen, University of Tokyo, University of Texas, Virginia Tech University, Vanderbilt University, Waseda University, Bauhaus Universität Weimar, ETH Zürich, etc.
Addlink Software Científíco, S.L., CADFEM GmbH, CADFEM Engg. Services India Pvt. Ltd., CADFEM US, Inc., CCA Engineering Simulation Software Co., Ltd., Dynardo GmbH, Hulinks Inc., iCUBED Inc., Kimhua Technologies Inc., MESco, Pera-CADFEM, PTC, Scientific Formosa, Inc., Sigma Plus, Springer-Verlag, Tashtit Scientific Consultant Ltd., TechNet Alliance